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green mode pwm controller ap384xg data sheet 1 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited general description the ap384xg is a green mode pwm controller. it is specially designed for off-line ac-dc adapter and bat- tery charger applications where both needs for low standby power and high efficiency in normal operation are required. in a well designed product, the ap384xg is capable to allow the sy stem consuming only 0.5w power in standby mode. in normal operation, the ap384xg features adjustable frequency by using an external resistor and capacitor combination. when output power falls below a given level, the ic automatically switches to the skip mode, which works by skipping switching cycles. the ap384xg also features low start-up and low standby operating current for its special topology. the ap384xg provides accurate protection against over-temperature, over-current and maximal output power. the ap384xg is available in soic-8 and dip-8 packages. features green mode pwm controller to support the "blue angel" norm adjustable skip cycle mode operation low start-up current: 50 a (typ.) low standby operating current: 6ma internal leading edge blanking adjustable oscillator frequency up to 500khz totem pole output under voltage lock out (uvlo) over-temperature protection pin to pin replacement for az384xa applications off-line converter dc-dc converter dvd/stb power supply power adapter crt monitor power supply figure 1. package types of ap384xg soic-8 dip-8 option 1 option 2
green mode pwm controller ap384xg data sheet 2 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 2. pin configuration of ap384xg (top view) pin configuration pin description pin number pin name function 1 comp this pin is the error amplifier output and is made available for loop compensation. 2 fb the inverting input of the error amplifier. it is normally connected to the switching power supply output through an external resistor divider. 3 cs it is used either for current sense (normal mode) or skip cycle level selection (standby mode). 4r t /c t the oscillator frequency and maximum output duty cycle are programmed by connecting resistor r t to ref and capacitor c t to ground. 5 gnd the ground pin. 6 output this output directly drives the gate of a power mosfet. peak currents up to 1.0 a are sourced and sunk by this pin. 7 vcc the power supply pin. 8ref this is the reference output. it provides charging current for capacitor c t through resistor r t . comp cs fb r t /c t ref vcc gnd output m package (soic-8) m package (soic-8) p package (dip-8) comp cs fb r t /c t ref vcc gnd output 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5
green mode pwm controller ap384xg data sheet 3 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited functional block diagram figure 3. functional block diagram of ap384xg vcc gnd r t /c t fb cs comp ref output package tempera- ture range part number marking id packing type lead free green lead free green soic-8 -40 to 85 o c ap3842/3/4/5gm-e1 ap3842/3/4/5gm-g1 3842/3/4/5gm-e1 3842/3/4/5gm-g1 tube ap3842/3/4/5gmtr-e1 ap3842/3/4/5gmtr-g1 3842/3/4/5gm-e1 3842/3/4/5gm-g1 tape & reel dip-8 -40 to 85 o c ap3842/3/4/5gp-e1 ap3842/3/4/5gp-g1 ap3842/3/4/5gp-e1 ap3842/3/4/5gp-g1 tube circuit type package p: dip-8 m: soic-8 e1: lead free ap384xg - tr: tape and reel blank: tube osc vref good logic over temp protect internal bias 2r r s/r 5v ref uvlo 2.50v pwm latch current sense comparator error amp 34v 1v s r q q 3 1 2 4 5 7 8 6 ordering information bcd semiconductor's pb-free products, as designated with "e1" suffix in the part number, are rohs compliant. products with "g1" suffix are available in green packages. g1: green
green mode pwm controller ap384xg data sheet 4 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited parameter symbol value unit supply voltage v cc 30 v gate output current i o 1 a analog inputs (pin2, 3) v(ana) -0.3 to 6.3 v error amp output sink current i sink (e.a) 20 ma power dissipation at t a < 25 o c (dip-8) p d (note 3) 1000 mw power dissipation at t a <25 o c (soic-8) p d (note 3) 460 mw storage temperature range t stg -65 to 150 o c ambient temperature t a -40 to 85 o c lead temperature (soldering, 10sec) t lead +300 o c esd (machine model) 300 v note 1: stresses greater than those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those in di- cated under "recommended operating conditions" is not implied. exposure to "absolute maximum ratings" for extended periods may affect device reliability. note 2: all voltages are with respect to pin gnd and all currents are positive into specified terminal. note 3: board thickness 1.6mm, board dimension 90mm x 90mm. parameter symbol min max unit oscillation frequency f 500 khz ambient temperature t a -40 85 o c recommended operating conditions absolute maximum ratings (note 1,
green mode pwm controller ap384xg data sheet 5 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited (v cc =15v, r t =10k c t =3.3nf, t a =25 o c, unless otherwise specified.) note 4: this parameter is measured with rt=10k to v ref, it contributes 0.3ma of current to the measured value. so the total current flowing into the ct pin will be 0.3ma higher than the measured value approximately. electrical characteristics parameter symbol conditions min typ max unit reference section reference output voltage v ref t a =25 o c, i ref =1ma 4.95 5.00 5.05 v total output variation line, load, temp. 4.9 5.10 v line regulation v ref 12v v cc 25v 4 15 mv load regulation v ref 1ma i ref 20ma 4 15 mv short circuit output current i sc t a =25 o c -100 -180 ma temperature stability (note 6) 0.3 mv/ o c under voltage lock out section start-up threshold ap3842g/ap3844g 15 16 17 v ap3843g/ap3845g 7.8 8.4 9.0 minimum operating voltage ap3842g/ap3844g 8.5 10 11.5 v ap3843g/ap3845g 7.0 7.6 8.2 total standby current section start-up current ap3842g/ap3844g, v cc =14v 50 80 a ap3843g/ap3845g, v cc =6.5v 50 80 operating current v fb =0, v cs =0, c l =1nf 8 ma standby operating current v fb =2.7v, v cs =0.5v 6 ma zener voltage i cc =25ma 30 34 v pwm section maximum duty cycle ap3842g/ap3843g 94 96 % ap3844g/ap3845g 46 48 50 minimum duty cycle 0% oscillator section oscillation frequency f t a =25 o c 47 52 57 khz oscillator amplitude v osc pin rt/ct, peak to peak 1.7 v temperature stability 2 % voltage stability 12v v cc 25v 0.2 1 % discharge current v rt/ct = 2v (note 4) 8.5 9.5 10.5 ma
green mode pwm controller ap384xg data sheet 6 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited parameter symbol conditions min typ max unit error amplifier section input voltage v i v comp =2.5v 2.45 2.50 2.55 v output sink current i sink v comp =1.1v 6 10 ma output source current i source v comp =5v -0.5 -0.8 ma high output voltage v oh r l =15k to gnd 5 7 v low output voltage v ol r l =15k to pin ref 0.7 1.1 v voltage gain 2v v o 4v 65 90 db power supply rejection ratio psrr 12v v cc 25v 60 70 db current sense section maximum input signal v i (max) v comp =5v (note 5) 0.9 1 1.1 v gain gv 0v v cs 4v (note 5, 6) 2.85 3 3.15 v/v power supply rejection ratio psrr 12v v cc 25v (note 5, 7) 70 db delay to output v cs = 0 to 2v (note 7) 150 250 ns input bias current i bias v output =high -3 -10 a leading edge blanking duration t leb 250 ns output section low output voltage v ol i sink = 20ma 0.2 0.4 v i sink = 200ma 1.4 2.2 v high output voltage v oh i source = 20ma 13 13.5 v i source = 200ma 12 13 v rise time t r t a =25 o c, c l =1nf 150 250 ns fall time t f t a =25 o c, c l =1nf 50 150 ns skip cycle mode section source current (@cs) v output =low, t a =25 o c 180 200 220 a over-temperature protect section shutdown temperature t shut 155 o c temperature hysteresis t hys 25 o c thermal resistance (junction to case) jc soic-8 18 o c/w dip-8 12 a= , 0 vpin3 0.8v vpin 3 note 5: parameters are tested at trip point of latch with vpin2 = 0. note 6: here gain is defined as: vpin 1 note 7: these parameters, although guaranteed, are not 100% tested in production. electrical characteristics (continued)
green mode pwm controller ap384xg data sheet 7 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 4. basic test circuit figure 4 is the basic test circuit for ap384xg. in testing, the high peak currents associated with capacitive loads necessitate careful grounding techniques. timing and bypa ss capacitors should be connected close to pin 5 in a single point ground. the transistor and 5k potentiometer are used to sample the oscillator waveform and apply an adjustable ramp to pin 3. electrical characteristics (continued) 1 2 8 7 ap3842g 3 45 6 ref vcc output gnd r t /c t cs fb comp v ref v cc output gnd 1k 1w c t 5k i sense adjust 1k error amp adjust 4.7k 100k 2n2222 4.7k r t 0.1 f 0.1 f a
green mode pwm controller ap384xg data sheet 8 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 7. reference voltage vs. ambient temperature figure 8. start-up current vs. supply voltage typical performance characteristics figure 5. oscillator dead time vs. timing capacitor figure 6. timing resistor vs. frequency 1 10 100 1 10 0.3 30 3 47 22 4.7 2.2 dead time ( s) timing capacitor (nf) 100 1k 10k 100k 1m 10k 100k 5k 50k c t = 1 n f c t = 1 0 n f rt ( ) frequency (hz) c t = 1 0 0 n f -40-20 0 20406080100120 4.980 4.985 4.990 4.995 5.000 5.005 5.010 5.015 v cc =15v, i o =1ma reference voltage (v) ambient temperature ( o c) 0 2 4 6 8 1012141618 0 10 20 30 40 50 60 70 80 ap3842g/44g start-up current ( a) supply voltage (v) ap3843g/45g
green mode pwm controller ap384xg data sheet 9 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 9. output saturation characteristics figure 10. error amplifier open-loop frequency response 0 50 100 150 200 250 300 350 400 450 500 550 600 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 v cc =15v, t a =25 o c saturation voltage (v) output sink current (ma) figure 11. start-up current vs. ambient temperature typical performance characteristics (continued) 10 100 1k 10k 100k 1m 0 10 20 30 40 50 60 70 80 90 voltage gain (db) frequency (hz) v cc =15v, t a =25 o c -40 -20 0 20 40 60 80 100 120 30 40 50 60 70 80 90 ap3843g/45g, v cc =6.5v start-up current ( a) ambient temperature ( o c) ap3842g/44g, v cc =14v
green mode pwm controller ap384xg data sheet 10 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited typical application figure 12. typical application of ap384xg in ac/dc converter + 8 4 6 3 + + jp1 ac 90 to 264v r2 1.2m c14 100 /400v c2 0.01 600v r3 39k 2w d1 fr107 t d3 8tq100 l3 10 c9 2200 c10 1000 c11 1 r21 3k z2 sa12a jp2 12v/5a c1 47 r4 4.7 d2 1n4001 u1 ap384xg v cc 7 2 1 5 vcc ref fb r t /c t comp output gnd cs u2 pc817 c5 220p r14 130k r13 15k r12 100 z1 1n5819 r7 2k r6 10 q1 irf830 r9 10k r10 0.51/1w c6 220p/600v r5 10k c8 0.22 r15 100 r16 8.2k w1 1k r18 1k r17 2k u3 az431 ntc c3 0.1 c4 3.3n + r11 820 c7 680p r19 10 c15 2.2n r20 1m
green mode pwm controller ap384xg data sheet 11 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited mechanical dimensions soic-8 unit: mm(inch) 0 8 1 7 r 0 . 1 5 0 ( 0 . 0 0 6 ) r0.150(0.006) 1.000(0. 039) 0.300(0.012) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0. 004) 0.300(0. 012) 0.900(0. 035) 3.800(0. 150) 4.000(0. 157) 7 7 2 0 : 1 d 1.270(0. 050) typ 0.150(0. 006) 0.250(0. 010) 8 d 5.800(0. 228) 6.200(0. 244) 0.675(0. 027) 0.725(0. 029) 0.320(0. 013) 8 0.450(0. 017) 0.800(0. 031) 4.700(0.185) note: eject hole , oriented hole and mold mark is optional . option 1 option 1 option 2 0.350(0.014) typ typ typ typ
green mode pwm controller ap384xg data sheet 12 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited mechanical dimensions (continued) unit: mm(inch) dip-8 4 6 r0.750(0.030) 0.254(0.010)typ 0.130(0.005)min 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014) 7.620(0.300)typ 4 6 5 0.700(0.028) 9.000(0.354) 9.600(0.378) 3.710(0.146) 4.310(0.170) 3.000(0.118) 3.600(0.142) 0.360(0.014) 0.560(0.022) 2.540(0.100) typ 6.200(0.244) 6.600(0.260) 3.200(0.126) 3.600(0.142) 0.510(0.020)min 3.000(0.118) depth 0.100(0.004) 0.200(0.008) 1.524(0.060) typ note: eject hole, oriented hole and mold mark is optional.
green mode pwm controller ap384xg data sheet 13 jul. 2013 rev. 2. 0 bcd semiconductor manufacturing limited mounting pad layout unit: mm(inch) soic-8 dimensions z (mm)/(inch) g (mm)/(inch) x (mm)/(inch) y (mm)/(inch) e (mm)/(inch) value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050 grid placement courtyard zg y ex
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yishan road, shanghai 200233, china tel: +021-6485-1491, fa x: +86-021-5450-0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manu facturing co., ltd., shenzhen office unit a room 1203,skyworth bldg., gaoxin ave.1.s., nanshan district shenzhen 518057, china tel: +86-0755-8660-4900, fax: +86-0755-8660-4958 taiwan office (taipei) bcd semiconductor (taiwan) company limited 3f, no.17, lane 171, sec. 2, jiu-zong rd., ne i-hu dist., taipei(114), taiwan, r.o.c tel: +886-2-2656 2808 fax: +886-2-2656-2806/26562950 taiwan office (hsinchu) bcd semiconductor (taiwan) company limited 8f, no.176, sec. 2, gong-dao 5th road, east district hsinchu city 300, taiwan, r.o.c tel: +886-3-5160181, fax: +886-3-5160181 - headquarters bcd (shanghai) micro-electronics limited no. 1600, zi xing road, shanghai zizhu scie nce-based industrial park, 200241, p. r.c. tel: +86-021-2416-2266, fax: +86-021-2416-2277 usa office bcd semiconductor corp. 48460 kato road, fremont, ca 94538, usa tel: +1-510-668-1950 fax: +1-510-668-1990 korea office bcd semiconductor limited korea office. room 101-1112, digital-empire ii, 486 sin-dong, yeongtong-gu, suwon-city, gyeonggi-do, korea tel: +82-31-695-8430 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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